Hot Bar Reflow Soldering Process

The base substrate is located in a fixture and flux is applied to the pads. The parts are then cooled below the solidification temperature to form a permanent electro mechanical bond. Pulsed heated soldering differs from traditional soldering because the reflow of solder is accomplished using a heating element called a thermode which is heated and cooled down for each connection.

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In preparation for the hot bar reflow soldering process the following preparation steps need to be taken.

Hot bar reflow soldering process.

Pressure is applied during the entire cycle including heating reflow and cooling. The flex is positioned in the parts fixture ensuring alignment of both sets of pads. Hot bar reflow soldering bonding fundamentals technical articles and whitepapers blogs videos training information and more. 3 layouts for hot bar reflow soldering.

Reflow soldering process overview. A process start signal is given to the soldering control unit. For components that require a very precise positioning hot bar reflow soldering is the most ideal process. Hot bar reflow soldering is a selective soldering process where two pre fluxed solder coated parts are heated using a heating element called a thermode or a hot bar to a sufficient temperature to melt the solder.

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